Pay in 4 interest-free payments of $3.25 Learn more
Ships within 48 hours · Estimated delivery Jul 29 - Aug 3
● Temperature lock function
ensure long-time holding work
Just click on a circuit within zxw and you instantly see every component on that line
modular and rubber coated heat blocks that can easily be turned on the side to see the exact placement of your chip under the scope
but we do not offer support for installing or using zxw
EMMC Chip Off Stencil uv ● Temperature lock functionSingle stencil for Direct BGA eMMC eMCP (221 153 169 254 162 186 ) for reballing BGA memory eMMC EMCP chips found in phones and tablets. Specification: Material: Stainless steel Type of stencils: direct heatingApplication: Chip off unencrypted Android mobile devices commonly use chips found in this reballing stencil
US$ 132.50
US$ 104.00
US$ 133.00
US$ 133.00
US$ 133.00
US$ 164.00
US$ 26.99